Now Offering New Direct EDA To Pattern Solutions
NORTH READING, Mass.--(BUSINESS WIRE)--
Teradyne,
Inc. (NYSE:TER) and Test
Insight announce the release of new pattern conversion solutions for UltraFLEX
to reduce design to test cycle times and expedite Silicon debug and
characterization. The new solutions include the ability to compile
hundreds of patterns in parallel using Linux-based Load Share Facilities
(LSF) as well as the ability to produce binary IG-XL
pattern files directly from electronic design automation (EDA) output
formats.
The standalone Linux-based compiler can be easily integrated into users’
pattern conversion flow. The compiler supports all UltraFLEX
digital instruments and triggering of other UltraFLEX instrument
families within a digital pattern. The Linux compiler complements the
existing Teradyne IG-XL Windows compiler for bulk conversion tasks by
enabling the use of a customer’s Linux based compute farm resources,
which are typically used by design and DFT engineers, to generate test
programs. The product has been tested and validated by several large
customers and is now available for all users.
The Test
Insight Tool Suite has also been updated to allow the generation of IG-XL
binary pattern files directly from STIL/WGL/VCD to Teradyne UltraFLEX
IG-XL binary formats within the ATEGEN toolset. It reduces the
complexity of pattern conversion to a single step process by leveraging
the Linux pattern compiler and the rich feature set of the Test Insight
Tool Suite for pattern conversion. "The tight cooperation with Teradyne
helps us improve our software solutions and keep up with the latest
needs of most advanced users in semiconductor test," said Meir Gellis,
CEO of Test Insight.
“Our customers are under increasing pressure to ramp their complex
System-on-a-Chip (SOC) devices as soon as samples are available. Device
data volumes typically exceed 100GB per device and these volumes have
traditionally grown by 15-20% per device generation. During early ramp,
test vectors can be fully regenerated 10-20 times, which presents test
engineers with a computational bottleneck during the critical debug chip
period. The Linux compiler enables our customers to compile hundreds of
GBs in minutes by leveraging customers’ existing compute farms. This
will enable UltraFLEX customers to ramp their products faster, allowing
more time to debug critical device issues," noted Gregory Smith, Vice
President of SOC Marketing at Teradyne.
About Test Insight
Test Insight Ltd. puts years of test engineering experience into
innovative software tools that provide better integration between design
and test. Using an innovative process, Test Insight software solutions
allow engineers to accomplish better results, easier and with higher
quality. Building on vast test engineering experience and adding cutting
edge sophisticated software development makes Test Insight products and
technology stand out in quality and performance. For further
information, contact us at info@testinsight.com
or visit www.testinsight.com.
About Teradyne
Teradyne
(NYSE:TER) is a leading supplier of Automatic Test Equipment used to
test semiconductors, wireless products, data storage and complex
electronic systems which serve consumer, communications, industrial and
government customers. In 2013, Teradyne had sales of $1.43 billion and
currently employs approximately 3,800 people worldwide. For more
information, visit www.teradyne.com.
For more information, contact:
Public Relations
Jessica
Faulkner, 978-370-1437
jessica.faulkner@teradyne.com
or
Shira
Sharon, Int' +972-3-7517383
shira@testinsight.com
Source: Teradyne, Inc.