The FLEX system has been the gold standard for analog-dominant SOC testing for over a decade. With over 2,300 systems installed worldwide, FLEX has been proven for a broad range of applications. Teradyne’s IG-XL software, used on all FLEX, J750 and UltraFLEX platforms, also enables faster test program development with higher quality code and shorter tester times. IG-XL has consistently been rated the #1 ATE software by customers in independent surveys.
“The FLEX test system exemplifies our commitment to innovation, as
exhibited through the shift from our previous legacy products, to our
new suite of product offerings,” said
“Facilitating the growth of emerging semiconductor companies is key to
our mission,” said
About Unisem
Unisem is a global provider of semiconductor assembly and test (OSAT)
services for many of the world's most successful electronics companies.
We offer an integrated suite of packaging and test services such as
wafer bumping, wafer probing, wafer grinding; a wide range of leadframe
and substrate IC packaging; wafer level CSP; and RF,analog, digital, and
mixed signal test. Our turnkey services include design, assembly, test,
failure analysis, and electrical, mechanical, and thermal
characterization and modeling. Unisem is an established MEMS OSAT with
several years of experience in volume consumer and automotive
production, in addition to a broad package portfolio covering multiple
applications. The company has factory locations in
For additional information on Unisem, please visit: www.unisemgroup.com. Follow Unisem on Twitter and on Linkedin.
About
alee@unisemgroup.com
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Public Relations
jessica.faulkner@teradyne.com
Source: Unisem