The UltraFLEX is the most advanced tester for complex SOC devices in the mobile communication, processor and networking spaces. It offers the highest performance Digital, RF, SERDES and DC instrumentation available on any ATE to provide the most precise characterization capability and highest production yields of any ATE in its class. Unique architectural capabilities such as automatically backgrounded DSP and complete instrument control from digital patterns also provide the highest throughput.
“The addition of a third UltraFLEX machine to our
“Teradyne is pleased to expand our relationship with Unisem," said
About Unisem
Unisem is a global provider of outsourced semiconductor assembly and
test (OSAT) services for many of the world's most successful electronics
companies. We offer an integrated suite of packaging and test services
such as wafer bumping, wafer probing, wafer grinding; a wide range of
leadframe and substrate IC packaging; wafer level CSP; and RF,analog,
digital, and mixed signal test. Our turnkey services include design,
assembly, test, failure analysis, and electrical, mechanical, and
thermal characterization and modeling. Unisem is an established MEMS
OSAT with several years of experience in volume consumer and automotive
production, in addition to a broad package portfolio covering multiple
applications. The company has factory locations in
For additional information on Unisem, please visit: www.unisemgroup.com. Follow Unisem on Twitter and on Linkedin.
About
Angela Lee, 408-685-1674
alee@unisemgroup.com
or
Jessica
Faulkner, 978-370-1437
Public Relations
jessica.faulkner@teradyne.com
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